Machine Tooling
Metal bond Diamond grinding wheel for sapphire, silicon,metal bond,grinding glass,grinding stone
2017-08-30 13:14  Visit:83
Price:Unfilled
Send inquiry
Model Number: D100~D250-#5308 Brand Name: XINYA Key Specifications/Special Features: Resin diamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors material have the highest sharpness and the best grinding effectThey are designed for grinding the surface of silicone ingot and sapphire ingot
Shipping Information:
  • FOB Port: Shanghai
  • Lead Time: 10 - 15 days
Main Export Markets:
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe
Message

TO: xydiamond

E-mail:

Content:

Contact information
Comment
0